Responsibilities
- Total ownership and accountability of manufacturing resources including Team Leadership and KPI's
- NPI
- Customer Interface and Support
- Product Characterization
- Testing and Failure Analysis
- Continuous Improvement of Processes
Requirements
- Bachelors Degree, Post Graduate Diploma or Professional Degree in Engineering ( Electrical, Electronics or Mechanical Engineering )
- Minimum 2 years of working experience in Semi Conductor Front of Line Assembly Processes with hands on experience in Wafer Back Grinding, Dicing, Die-Attach or Wire Bond preferred.
- Independent, resourceful and the ability to work with minimal supervision.
- Team player with strong interpersonal skills across all levels within the organization
- Ability to adapt and learn new concepts, process.
- Excellent technical problem solving skills.
Interested candidates are required to Fax / Email with a comprehensive resume stating qualification, experience, current and expected salary, expected date to start work to:
LD Technologies Sdn Bhd
No. 1, Taman Damai Jaya,
Jalan Changlun Jitar,
Kedah, Malaysia 06000
Tel: 604-9184801
Fax: 604-9172517
Email: shaliza@ldtsb.com.my
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